Intel 到底說了啥 - 股票

安安各位
看到板上亂糟糟
讓我們來看看 Intel CEO Gelsinger 到底說了啥

Gelsinger shared his vision for “IDM 2.0,” a major evolution of Intel’s
integrated device manufacturing (IDM) model.

Intel CEO 提出了所謂的 IDM 2.0 計畫, 並且把他列為 Intel 接下來發展的 "Vision", 國外的企業非常重視所謂的願景, 所以基本上他就是未來 Intel 在 integrated device manufacturer 上面的重大發展方向.

所以整場重點就是這個 IDM 2.0

IDM 2.0 represents the combination of three components that will enable the
company to drive sustained technology and product leadership:

IDM 2.0 主要有 3 個要點, 可以讓 Intel 保持技術/產品領導地位. 基本上就是再次闡述這個 IDM 2.0 的重要性

1. Intel’s global, internal factory network for at-scale manufacturing is a key
competitive advantage that enables product optimization, improved economics
and supply resilience. Today, Gelsinger re-affirmed the company’s
expectation to continue manufacturing the majority of its products
internally. The company’s 7nm development is progressing well, driven by
increased use of extreme ultraviolet lithography (EUV) in a rearchitected,
simplified process flow. Intel expects to tape in the compute tile for its
first 7nm client CPU (code-named “Meteor Lake”) in the second quarter of
this year. In addition to process innovation, Intel’s leadership in
packaging technology is an important differentiator that enables the
combination of multiple IPs or “tiles” to deliver uniquely tailored
products that meet diverse customer requirements in a world of pervasive
computing.

Intel CEO 重申 (re-affirmed) 希望 Intel 可以繼續在內部製造他們絕大多數的產品.

並且表明 Intel 7nm 目前的開發計畫順利, 已經導入跟台積電/三星一樣的 EUV 技術, 預計今年第 2 季會將 7nm 技術用於下一代的 Meteor Lake 中.

註: Meteor Lake 是 Intel 2023 要問世的 CPU 代號

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順帶來看看台積電的 Vision

願景成為全球最先進及最大的專業積體電路技術及製造服務業者，並且與我們無晶圓廠設
計公司及整合元件製造商的客戶群共同組成半導體產業中堅強的競爭團隊。

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2. Expanded use of third-party foundry capacity. Intel expects to build on its
existing relationships with third-party foundries, which today manufacture a
range of Intel technology – from communications and connectivity to graphics
and chipsets. Gelsinger said he expects Intel’s engagement with third-party
foundries to grow and to include manufacturing for a range of modular tiles
on advanced process technologies, including products at the core of Intel’s
computing offerings for both client and data center segments beginning in
2023. This will provide the increased flexibility and scale needed to
optimize Intel’s roadmaps for cost, performance, schedule and supply, giving
the company a unique competitive advantage.

Intel 之前就有外包通訊(communications)/圖形(graphics) 相關晶片給第三方代工廠.

Intel 2023 年開始, 會在現有的合作基礎上, 將部份 client (消費者端)/data center(資料中心) 使用的 Intel CPU 外包出去.

部份的外包有助於 Intel 維持彈性/預算控制/保持競爭力.

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補充:

CEO 的原話確實有提到 2023 年會跟 TSMC 合作去製造 CPU:

“For our 2023 roadmap, we will also leverage our relationship with TSMC to
deliver additional leadership CPU products for our client and data center
customers. This is the power of our new IDM 2.0 model combined with a modular
approach to design and Intel’s industry leading packaging technologies.”

會跟 TSMC 一起合作帶給大家更多領先的產品 (leadership CPU) 所以應該不是菜雞產品

3. Building a world-class foundry business, Intel Foundry Services. Intel
announced plans to become a major provider of U.S.– and Europe-based foundry
capacity to serve the incredible global demand for semiconductor
manufacturing. To deliver this vision, Intel is establishing a new standalone
business unit, Intel Foundry Services (IFS), led by semiconductor industry
veteran Dr. Randhir Thakur, who will report directly to Gelsinger. IFS will
be differentiated from other foundry offerings with a combination of
leading-edge process technology and packaging, committed capacity in the U.S.
and Europe, and a world-class IP portfolio for customers, including x86 cores
as well as ARM and RISC-V ecosystem IPs. Gelsinger noted that Intel’s
foundry plans have already received strong enthusiasm and statements of
support from across the industry.

最後這段, Intel 要成立世界一流 (world-class) 的代工廠.

他們的目標是要成為美國跟歐洲的主要晶片代工廠, 滿足全球對於晶片驚人的需求.

為了要完成這個願景 (Vision) Intel 成立了 Intel Foundry Services, 由 Dr. Randhir Thakur 負責, 並且直接匯報給 Intel CEO.

後面有提到這間代工廠是要提供最先進製程技術 (leading-edge technology).

目標的代工產品包括了現今主流 CPU 架構: x86/ARM/RISC-V.

Intel CEO 說這個計畫已經得到了業界的強烈支持.

This build-out represents an investment of approximately $20 billion, which
is expected to create over 3,000 permanent high-tech, high-wage jobs; over 3,000 construction jobs; and approximately 15,000 local long-term jobs

Intel 預計投入 $200 億鎂 (約台幣 5600 億) 預計會提供 3,000 個高科技工作機會, 以及 15,000 個穩定工作機會給當地.

Today, Arizona Gov. Doug Ducey and U.S. Secretary of Commerce Gina Raimondo
participated with Intel executives in the announcement

Arizona 洲政府也確定要陪 Intel 玩這個計畫.

--- 結論 ---

今天會多空不明的原因就是媒體各自擷取了 IDM 2.0 中的 2, 3 點出來講

Intel 為了保有 CPU 領先的地位, 所以海納百川加大跟第三方代工廠的合作.

同時也決定要自己跳下去做晶圓代工.

然後我還是重申, 美國企業對於願景 (Vision) 非常重視, 基本上能放到 Vision 的就是跟你玩真的.

至於是多是空呢 就留給大家討論.

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Reference

1. [Intel CEO Pat Gelsinger Announces ‘IDM 2.0’ Strategy for Manufacturing,
Innovation and Product Leadership](
https://newsroom.intel.com/news-releases/idm-manufacturing-innovation-product-leadership/)
2. [Intel Unleashed: Engineering the Future](
https://newsroom.intel.com/wp-content/uploads/sites/11/2021/03/CEO-Gelsinger-quotes-57285720.pdf)

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