1.原文連結：
https://goo.gl/PTgydz
2.原文內容：
Despite the recent market rumors indicating that Samsung Electronics may stop
using heat pipes for its new smartphones in 2018, sources from upstream
supply chain players have pointed out that the Korea-based vendor will
continue the thermal design and its suppliers have already begun small volume
production of related components.
Meanwhile, smartphone brand vendors are also trying out vapor chambers for
heat dissipation, but have so far not yet placed any orders. Since vendors'
demand for heat dissipation is expected to rise as they add more new
functionalities into their smartphones, the sources believe there is a high
chance for smartphone brands to adopt vapor chambers in 2019.
Because of their high prices, heat pipes so far are not a popular thermal
solution among smartphone vendors and are mainly used only in flagship models.
Vapor chambers' prices will be even higher but with better heat dissipation
efficiency than that of heat pipes, said sources, noting that worldwide
suppliers including Taiwan-based Chaun-Choung Technology (CCI) and Auras, and
Japan-based Furukawa, have already delivered samples to clients for testing.
CCI, which shipped its vapor chambers mainly to the server sector previously,
has started shipping related products to notebook vendors recently.
Demand for vapor chambers from notebook vendors have been picking up in the
past few years due to increasing shipments of ultra-thin gaming notebooks and
the adoption has started expanding to non-gaming ultra-thin models.
In addition to costs, the size of vapor chambers is also a major holdback for
smartphone vendors to considering adopting the component. However, related
makers have been pushing to reduce the thickness of vapor chamber and are
currently able to roll out 0.4mm thickness products, the sources added.
3.心得/評論：
三星明年將繼續使用熱導管用於手機，
台灣的幾家散熱公司(超眾、雙鴻)已經開始試產測試，
超薄型均熱片未來可能用於手機和薄型電競筆電。
0.4mm的均熱片，感覺跟前年超眾開發出的超薄熱導管差不多，
只是寬了一點。
散熱雙雄未來會爆發嗎?
--
https://goo.gl/PTgydz
2.原文內容：
Despite the recent market rumors indicating that Samsung Electronics may stop
using heat pipes for its new smartphones in 2018, sources from upstream
supply chain players have pointed out that the Korea-based vendor will
continue the thermal design and its suppliers have already begun small volume
production of related components.
Meanwhile, smartphone brand vendors are also trying out vapor chambers for
heat dissipation, but have so far not yet placed any orders. Since vendors'
demand for heat dissipation is expected to rise as they add more new
functionalities into their smartphones, the sources believe there is a high
chance for smartphone brands to adopt vapor chambers in 2019.
Because of their high prices, heat pipes so far are not a popular thermal
solution among smartphone vendors and are mainly used only in flagship models.
Vapor chambers' prices will be even higher but with better heat dissipation
efficiency than that of heat pipes, said sources, noting that worldwide
suppliers including Taiwan-based Chaun-Choung Technology (CCI) and Auras, and
Japan-based Furukawa, have already delivered samples to clients for testing.
CCI, which shipped its vapor chambers mainly to the server sector previously,
has started shipping related products to notebook vendors recently.
Demand for vapor chambers from notebook vendors have been picking up in the
past few years due to increasing shipments of ultra-thin gaming notebooks and
the adoption has started expanding to non-gaming ultra-thin models.
In addition to costs, the size of vapor chambers is also a major holdback for
smartphone vendors to considering adopting the component. However, related
makers have been pushing to reduce the thickness of vapor chamber and are
currently able to roll out 0.4mm thickness products, the sources added.
3.心得/評論：
三星明年將繼續使用熱導管用於手機，
台灣的幾家散熱公司(超眾、雙鴻)已經開始試產測試，
超薄型均熱片未來可能用於手機和薄型電競筆電。
0.4mm的均熱片，感覺跟前年超眾開發出的超薄熱導管差不多，
只是寬了一點。
散熱雙雄未來會爆發嗎?
--
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